Applications: Optical Windows Heat Spreaders, Electronic devices
01.Diamond Optical Windows
Due to the excellent transmittance of diamond from deep ultraviolet to far infrared, diamond window materials have broad application prospects in fields such as ultraviolet and X-ray transmission, as well as aerospace. Our company offers high-quality large size poly- and single-crystal diamond window materials to customers. The detailed parameters are as follows:
| Standard Specifications | ||
|---|---|---|
| Polycrystalline diamond | : Optical absorption | ≤0.07/cm @10.6μm |
| : Diameter | 1-4 inch | |
| : Thickness | ≤1mm | |
| : Roughness | Ra＜10nm | |
| : Flatness | ＜1fringe @ 632.8nm | |
| Single crystal diamond | : Optical absorption | ≤0.07/cm@10.6μm |
| : Diameter | 1-2 inch | |
| : Thickness | ＜5mm | |
| : Roughness |
Regular（Ra≤5nm） Fine（Ra≤1nm） |
|
| : Flatness | ＜1fringe@632.8nm | |
| Customizable Parameters | |
|---|---|
| 1: | Laser cutting various angles and shapes |
| 2: | Size 4 inch for polycrystalline diamond and 2 inch for Single crystal diamond |
02.Heat Spreaders
With the high integration of electronic systems, the heat flux density of devices has significantly increased, leading to a sharp rise in temperature. This severely limits the further improvement of device performance and can even cause device failure. Diamond, with an extremely high thermal conductivity (2200 W/mK), can provide effective heat dissipation for other semiconductor materials, thus aiding in the continuous enhancement of semiconductor device performance. Our company offers customers high-quality poly- and single-crystal diamond heat sinks, and can also perform micro-processing and metallization of diamond surfaces. The detailed technical parameters are as follows:
| Standard Specifications | ||
|---|---|---|
| Polycrystalline diamond | Thermal Conductivity : | ≥1800W/m·K |
| Size : | 1-4 inch | |
| Thickness : | ≤1mm | |
| Roughness : | Ra＜10nm | |
| Single crystal diamond | Thermal Conductivity : | 1000、1500、1800、2000 W/mK（Optional） |
| Size : | 1-2 inch | |
| Thickness : | ≤5mm | |
| Roughness : |
Regular（Ra≤5nm） Fine（Ra≤1nm） |
|
| Customizable Parameters | |
|---|---|
| 1 : | Metallization of diamond surfaces: Ti, Ni, Au, Mo, Cu, Ir, and their combinations, with support for custom metal patterning. |
| 2: | Laser cutting various angles and shapes |
| 3: | Size 4 inch for polycrystalline diamond and 2 inch for Single crystal diamond |
| 4: | Through-holes, and through-holes conductive. |
If you have special requirements regarding the application of diamonds, please contact us. We will customize suitable optical windows, heat spreaders, and devices according to your inquiries.
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